Ren, X., Zhao, Y., Yan, Z., Shi, Y., Yuan, Z., Lin, L., . . . Zhang, W. (2026). Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding. Laser & Photonics Reviews, 20(1), 1. https://doi.org/10.1002/lpor.202500826
Chicago Style (17th ed.) CitationRen, Xiaosong, Yao Zhao, Zhengyu Yan, Yanli Shi, Zhiliang Yuan, Linhan Lin, Hong‐Bo Sun, Yidong Huang, and Wei Zhang. "Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding." Laser & Photonics Reviews 20, no. 1 (2026): 1. https://doi.org/10.1002/lpor.202500826.
MLA (9th ed.) CitationRen, Xiaosong, et al. "Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding." Laser & Photonics Reviews, vol. 20, no. 1, 2026, p. 1, https://doi.org/10.1002/lpor.202500826.