Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding.
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| Title: | Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding. |
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| Authors: | Ren, Xiaosong1, Zhao, Yao2, Yan, Zhengyu3, Shi, Yanli4, Yuan, Zhiliang3, Lin, Linhan2, Sun, Hong‐Bo2, Huang, Yidong1,3, Zhang, Wei1,3, zwei@tsinghua.edu.cn |
| Source: | Laser & Photonics Reviews; 1/8/2026, Vol. 20 Issue 1, p1-8, 8p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 190770007 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=190770007 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/lpor.202500826 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 1 Titles: – TitleFull: Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ren, Xiaosong – PersonEntity: Name: NameFull: Zhao, Yao – PersonEntity: Name: NameFull: Yan, Zhengyu – PersonEntity: Name: NameFull: Shi, Yanli – PersonEntity: Name: NameFull: Yuan, Zhiliang – PersonEntity: Name: NameFull: Lin, Linhan – PersonEntity: Name: NameFull: Sun, Hong‐Bo – PersonEntity: Name: NameFull: Huang, Yidong – PersonEntity: Name: NameFull: Zhang, Wei IsPartOfRelationships: – BibEntity: Dates: – D: 08 M: 01 Text: 1/8/2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 18638880 Numbering: – Type: volume Value: 20 – Type: issue Value: 1 Titles: – TitleFull: Laser & Photonics Reviews Type: main |
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