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Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding.

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Bibliographic Details
Title: Integration of InGaAs/InP Single Photon Avalanche Diode and Thin Film Lithium Niobate Photonic Chip via Photonic Wire Bonding.
Authors: Ren, Xiaosong1, Zhao, Yao2, Yan, Zhengyu3, Shi, Yanli4, Yuan, Zhiliang3, Lin, Linhan2, Sun, Hong‐Bo2, Huang, Yidong1,3, Zhang, Wei1,3, zwei@tsinghua.edu.cn
Source: Laser & Photonics Reviews; 1/8/2026, Vol. 20 Issue 1, p1-8, 8p
Database: Applied Science & Technology Source
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