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Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders.

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Bibliographic Details
Title: Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders.
Authors: Trinh, Cham Thi1, thi.trinh@uni-saarland.de, Wiese, Steffen1
Source: Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p601, 22p
Database: Applied Science & Technology Source
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ISSN:20763417
DOI:10.3390/app16020601