APA (7th ed.) Citation

Trinh, C. T., & Wiese, S. (2026). Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders. Applied Sciences (2076-3417), 16(2), 601. https://doi.org/10.3390/app16020601

Chicago Style (17th ed.) Citation

Trinh, Cham Thi, and Steffen Wiese. "Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders." Applied Sciences (2076-3417) 16, no. 2 (2026): 601. https://doi.org/10.3390/app16020601.

MLA (9th ed.) Citation

Trinh, Cham Thi, and Steffen Wiese. "Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders." Applied Sciences (2076-3417), vol. 16, no. 2, 2026, p. 601, https://doi.org/10.3390/app16020601.