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Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.

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Bibliographic Details
Title:	Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.
Authors:	Mohammad, Suleiman Ibrahim^1,2, Vasudevan, Asokan^3,4, Sujai, S.⁵, Pradhan, Premananda⁶, Thykattusserry, Nivin Joy⁷, Singh, Ripendeep⁸, Bisht, Yashwant Singh⁹, yashwantb3@gmail.com
Source:	Journal of Electronic Materials; Mar2026, Vol. 55 Issue 3, p3248-3262, 15p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-025-12669-x