APA (7th ed.) Citation

Mohammad, S. I., Vasudevan, A., Sujai, S., Pradhan, P., Thykattusserry, N. J., Singh, R., & Bisht, Y. S. (2026). Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue. Journal of Electronic Materials, 55(3), 3248. https://doi.org/10.1007/s11664-025-12669-x

Chicago Style (17th ed.) Citation

Mohammad, Suleiman Ibrahim, Asokan Vasudevan, S. Sujai, Premananda Pradhan, Nivin Joy Thykattusserry, Ripendeep Singh, and Yashwant Singh Bisht. "Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections Under Thermomechanical Fatigue." Journal of Electronic Materials 55, no. 3 (2026): 3248. https://doi.org/10.1007/s11664-025-12669-x.

MLA (9th ed.) Citation

Mohammad, Suleiman Ibrahim, et al. "Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections Under Thermomechanical Fatigue." Journal of Electronic Materials, vol. 55, no. 3, 2026, p. 3248, https://doi.org/10.1007/s11664-025-12669-x.