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Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.

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Title: Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.
Authors: Mohammad, Suleiman Ibrahim1,2, Vasudevan, Asokan3,4, Sujai, S.5, Pradhan, Premananda6, Thykattusserry, Nivin Joy7, Singh, Ripendeep8, Bisht, Yashwant Singh9, yashwantb3@gmail.com
Source: Journal of Electronic Materials; Mar2026, Vol. 55 Issue 3, p3248-3262, 15p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191486994
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191486994
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-025-12669-x
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 15
        StartPage: 3248
    Titles:
      – TitleFull: Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue.
        Type: main
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      – PersonEntity:
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            NameFull: Mohammad, Suleiman Ibrahim
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            NameFull: Vasudevan, Asokan
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            NameFull: Sujai, S.
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            NameFull: Pradhan, Premananda
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            NameFull: Thykattusserry, Nivin Joy
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            NameFull: Singh, Ripendeep
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            NameFull: Bisht, Yashwant Singh
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            – D: 01
              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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            – TitleFull: Journal of Electronic Materials
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