Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.
Saved in:
| Title: | Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing. |
|---|---|
| Authors: | Luo, Suibin1, suibin@gzhu.edu.cn, Sui, Yuying2, Yu, Junyi1, Gao, Chunbo3, Zhu, Chuanxi3, Xu, Pengpeng4, Li, Wen‐Di5, liwd@hku.hk, Wei, Xun6, Yu, Shuhui1, yush105709@gzhu.edu.cn |
| Source: | Advanced Engineering Materials; 2/18/2026, Vol. 28 Issue 4, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 14381656 |
|---|---|
| DOI: | 10.1002/adem.202502745 |
