Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.

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Title: Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.
Authors: Luo, Suibin1, suibin@gzhu.edu.cn, Sui, Yuying2, Yu, Junyi1, Gao, Chunbo3, Zhu, Chuanxi3, Xu, Pengpeng4, Li, Wen‐Di5, liwd@hku.hk, Wei, Xun6, Yu, Shuhui1, yush105709@gzhu.edu.cn
Source: Advanced Engineering Materials; 2/18/2026, Vol. 28 Issue 4, p1-9, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191772274
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PubType: Academic Journal
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  Data: Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.
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  Data: <searchLink fieldCode="AU" term="%22Luo%2C+Suibin%22">Luo, Suibin</searchLink><relatesTo>1</relatesTo>, <i>suibin@gzhu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Sui%2C+Yuying%22">Sui, Yuying</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Junyi%22">Yu, Junyi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Gao%2C+Chunbo%22">Gao, Chunbo</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Chuanxi%22">Zhu, Chuanxi</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Pengpeng%22">Xu, Pengpeng</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Wen‐Di%22">Li, Wen‐Di</searchLink><relatesTo>5</relatesTo>, <i>liwd@hku.hk</i><br /><searchLink fieldCode="AU" term="%22Wei%2C+Xun%22">Wei, Xun</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Shuhui%22">Yu, Shuhui</searchLink><relatesTo>1</relatesTo>, <i>yush105709@gzhu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Engineering+Materials%22">Advanced Engineering Materials</searchLink>; 2/18/2026, Vol. 28 Issue 4, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191772274
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      – Type: doi
        Value: 10.1002/adem.202502745
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      – Code: eng
        Text: English
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        PageCount: 9
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      – TitleFull: Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.
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              M: 02
              Text: 2/18/2026
              Type: published
              Y: 2026
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            – TitleFull: Advanced Engineering Materials
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