Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing.
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| Title: | Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing. |
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| Authors: | Luo, Suibin1, suibin@gzhu.edu.cn, Sui, Yuying2, Yu, Junyi1, Gao, Chunbo3, Zhu, Chuanxi3, Xu, Pengpeng4, Li, Wen‐Di5, liwd@hku.hk, Wei, Xun6, Yu, Shuhui1, yush105709@gzhu.edu.cn |
| Source: | Advanced Engineering Materials; 2/18/2026, Vol. 28 Issue 4, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 191772274 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Luo%2C+Suibin%22">Luo, Suibin</searchLink><relatesTo>1</relatesTo>, <i>suibin@gzhu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Sui%2C+Yuying%22">Sui, Yuying</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Junyi%22">Yu, Junyi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Gao%2C+Chunbo%22">Gao, Chunbo</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Chuanxi%22">Zhu, Chuanxi</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Pengpeng%22">Xu, Pengpeng</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Wen‐Di%22">Li, Wen‐Di</searchLink><relatesTo>5</relatesTo>, <i>liwd@hku.hk</i><br /><searchLink fieldCode="AU" term="%22Wei%2C+Xun%22">Wei, Xun</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Shuhui%22">Yu, Shuhui</searchLink><relatesTo>1</relatesTo>, <i>yush105709@gzhu.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Advanced+Engineering+Materials%22">Advanced Engineering Materials</searchLink>; 2/18/2026, Vol. 28 Issue 4, p1-9, 9p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191772274 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/adem.202502745 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Titles: – TitleFull: Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Luo, Suibin – PersonEntity: Name: NameFull: Sui, Yuying – PersonEntity: Name: NameFull: Yu, Junyi – PersonEntity: Name: NameFull: Gao, Chunbo – PersonEntity: Name: NameFull: Zhu, Chuanxi – PersonEntity: Name: NameFull: Xu, Pengpeng – PersonEntity: Name: NameFull: Li, Wen‐Di – PersonEntity: Name: NameFull: Wei, Xun – PersonEntity: Name: NameFull: Yu, Shuhui IsPartOfRelationships: – BibEntity: Dates: – D: 18 M: 02 Text: 2/18/2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 14381656 Numbering: – Type: volume Value: 28 – Type: issue Value: 4 Titles: – TitleFull: Advanced Engineering Materials Type: main |
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