Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices.
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| Title: | Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices. |
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| Authors: | Abbas, Waseem1,2, wabbas3-c@my.cityu.edu.hk, Ibrahim, Mesfin S.3, Lu, Chang1, Hou, Yuluo1, Lee, Hiu Hung1, rainbowlee519@gmail.com, Zulfiqar, Adil1,2, Adil.zulfiqar@nu.edu.pk, Loo, K.H.1, kh.loo@polyu.edu.hk |
| Source: | Microelectronics Reliability; Apr2026, Vol. 179, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2026.116056 |
