APA (7th ed.) Citation

Abbas, W., Ibrahim, M. S., Lu, C., Hou, Y., Lee, H. H., Zulfiqar, A., & Loo, K. (2026). Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices. Microelectronics Reliability, 179, N.PAG. https://doi.org/10.1016/j.microrel.2026.116056

Chicago Style (17th ed.) Citation

Abbas, Waseem, Mesfin S. Ibrahim, Chang Lu, Yuluo Hou, Hiu Hung Lee, Adil Zulfiqar, and K.H Loo. "Impacts and Mitigation Strategies of Process-induced Packaging Defects for Enhancing Reliability of Power Devices." Microelectronics Reliability 179 (2026): N.PAG. https://doi.org/10.1016/j.microrel.2026.116056.

MLA (9th ed.) Citation

Abbas, Waseem, et al. "Impacts and Mitigation Strategies of Process-induced Packaging Defects for Enhancing Reliability of Power Devices." Microelectronics Reliability, vol. 179, 2026, p. N.PAG, https://doi.org/10.1016/j.microrel.2026.116056.