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Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices.

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Title: Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices.
Authors: Abbas, Waseem1,2, wabbas3-c@my.cityu.edu.hk, Ibrahim, Mesfin S.3, Lu, Chang1, Hou, Yuluo1, Lee, Hiu Hung1, rainbowlee519@gmail.com, Zulfiqar, Adil1,2, Adil.zulfiqar@nu.edu.pk, Loo, K.H.1, kh.loo@polyu.edu.hk
Source: Microelectronics Reliability; Apr2026, Vol. 179, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192196749
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Abbas%2C+Waseem%22">Abbas, Waseem</searchLink><relatesTo>1,2</relatesTo>, <i>wabbas3-c@my.cityu.edu.hk</i><br /><searchLink fieldCode="AU" term="%22Ibrahim%2C+Mesfin+S%2E%22">Ibrahim, Mesfin S.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Chang%22">Lu, Chang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hou%2C+Yuluo%22">Hou, Yuluo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Hiu+Hung%22">Lee, Hiu Hung</searchLink><relatesTo>1</relatesTo>, <i>rainbowlee519@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Zulfiqar%2C+Adil%22">Zulfiqar, Adil</searchLink><relatesTo>1,2</relatesTo>, <i>Adil.zulfiqar@nu.edu.pk</i><br /><searchLink fieldCode="AU" term="%22Loo%2C+K%2EH%2E%22">Loo, K.H.</searchLink><relatesTo>1</relatesTo>, <i>kh.loo@polyu.edu.hk</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>; Apr2026, Vol. 179, pN.PAG-N.PAG, 1p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192196749
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2026.116056
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: N.PAG
    Titles:
      – TitleFull: Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Abbas, Waseem
      – PersonEntity:
          Name:
            NameFull: Ibrahim, Mesfin S.
      – PersonEntity:
          Name:
            NameFull: Lu, Chang
      – PersonEntity:
          Name:
            NameFull: Hou, Yuluo
      – PersonEntity:
          Name:
            NameFull: Lee, Hiu Hung
      – PersonEntity:
          Name:
            NameFull: Zulfiqar, Adil
      – PersonEntity:
          Name:
            NameFull: Loo, K.H.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 00262714
          Numbering:
            – Type: volume
              Value: 179
          Titles:
            – TitleFull: Microelectronics Reliability
              Type: main
ResultId 1