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Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.

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Bibliographic Details
Title: Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.
Authors: Wu, Hai1,2,3, Chen, Liangliang1,2,3, Zhu, Liguo1,2,3,4, Kong, Lingxin1,2,3,4, Liu, Ganggang1,2,3, Yang, Bin1,2,3,4, Deng, Yong1,2,3,4
Source: Metals (2075-4701); Mar2026, Vol. 16 Issue 3, p330, 16p
Database: Applied Science & Technology Source
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ISSN:20754701
DOI:10.3390/met16030330