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Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.

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Title: Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.
Authors: Wu, Hai1,2,3, Chen, Liangliang1,2,3, Zhu, Liguo1,2,3,4, Kong, Lingxin1,2,3,4, Liu, Ganggang1,2,3, Yang, Bin1,2,3,4, Deng, Yong1,2,3,4
Source: Metals (2075-4701); Mar2026, Vol. 16 Issue 3, p330, 16p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192637496
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192637496
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.3390/met16030330
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      – Code: eng
        Text: English
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        StartPage: 330
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      – TitleFull: Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.
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            NameFull: Wu, Hai
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            NameFull: Chen, Liangliang
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            NameFull: Zhu, Liguo
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            NameFull: Yang, Bin
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            – D: 01
              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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