From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability.
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| Title: | From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability. |
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| Authors: | Gutnik, Dominik1,2, Casari, Daniele2, Pethö, Laszlo2, Burtscher, Michael1, Hofer‐Roblyek, Anna M.1, Mitterer, Christian1, Putz, Barbara1,2, barbara.putz@empa.ch |
| Source: | Advanced Materials Interfaces; 4/7/2026, Vol. 13 Issue 7, p1-16, 16p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21967350 |
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| DOI: | 10.1002/admi.202501037 |
