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From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability.

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Title: From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability.
Authors: Gutnik, Dominik1,2, Casari, Daniele2, Pethö, Laszlo2, Burtscher, Michael1, Hofer‐Roblyek, Anna M.1, Mitterer, Christian1, Putz, Barbara1,2, barbara.putz@empa.ch
Source: Advanced Materials Interfaces; 4/7/2026, Vol. 13 Issue 7, p1-16, 16p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192816914
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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      – Type: doi
        Value: 10.1002/admi.202501037
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      – Code: eng
        Text: English
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      – TitleFull: From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability.
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            – D: 07
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              Text: 4/7/2026
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              Y: 2026
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