Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.
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| Title: | Thermal analysis of 3D GPU-memory architectures with boron nitride interposer. |
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| Authors: | Wang, Eric Han1, Yan, Weijia2, weijia_yan@tamu.edu, Huang, Ruihong3, huangrh@tamu.edu |
| Source: | MRS Communications; Apr2026, Vol. 16 Issue 2, p537-542, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21596859 |
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| DOI: | 10.1557/s43579-025-00913-8 |
