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Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.

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Title: Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.
Authors: Wang, Eric Han1, Yan, Weijia2, weijia_yan@tamu.edu, Huang, Ruihong3, huangrh@tamu.edu
Source: MRS Communications; Apr2026, Vol. 16 Issue 2, p537-542, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192873225
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Eric+Han%22">Wang, Eric Han</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yan%2C+Weijia%22">Yan, Weijia</searchLink><relatesTo>2</relatesTo>, <i>weijia_yan@tamu.edu</i><br /><searchLink fieldCode="AU" term="%22Huang%2C+Ruihong%22">Huang, Ruihong</searchLink><relatesTo>3</relatesTo>, <i>huangrh@tamu.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22MRS+Communications%22">MRS Communications</searchLink>; Apr2026, Vol. 16 Issue 2, p537-542, 6p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192873225
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    Identifiers:
      – Type: doi
        Value: 10.1557/s43579-025-00913-8
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 537
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      – TitleFull: Thermal analysis of 3D GPU-memory architectures with boron nitride interposer.
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            NameFull: Wang, Eric Han
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            NameFull: Yan, Weijia
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            NameFull: Huang, Ruihong
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            – D: 01
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
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