Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.
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| Title: | Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling. |
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| Authors: | Chiang, Kai-chieh1, Koslowski, Marisol1, marisol@purdue.edu |
| Source: | Journal of Electronic Materials; May2026, Vol. 55 Issue 5, p4580-4589, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-026-12756-7 |
