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Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.

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Bibliographic Details
Title: Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.
Authors: Chiang, Kai-chieh1, Koslowski, Marisol1, marisol@purdue.edu
Source: Journal of Electronic Materials; May2026, Vol. 55 Issue 5, p4580-4589, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192873920
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Chiang%2C+Kai-chieh%22">Chiang, Kai-chieh</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Koslowski%2C+Marisol%22">Koslowski, Marisol</searchLink><relatesTo>1</relatesTo>, <i>marisol@purdue.edu</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; May2026, Vol. 55 Issue 5, p4580-4589, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192873920
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-026-12756-7
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 10
        StartPage: 4580
    Titles:
      – TitleFull: Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Chiang, Kai-chieh
      – PersonEntity:
          Name:
            NameFull: Koslowski, Marisol
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 05
              Text: May2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 55
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1