Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition.
Saved in:
| Title: | Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition. |
|---|---|
| Authors: | Han, Yafeng1, 546032664@qq.com, Hao, Bohao2, Qu, Shuwei2,3, shuweiqu1222@nuc.edu.cn, Wang, Hongfu2,3, Li, Ruiqin2, Yao, Wei2,3 |
| Source: | Journal of Wuhan University of Technology; Apr2026, Vol. 41 Issue 2, p512-522, 11p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10002413 |
|---|---|
| DOI: | 10.1007/s11595-026-3270-5 |
