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Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition.

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Title: Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition.
Authors: Han, Yafeng1, 546032664@qq.com, Hao, Bohao2, Qu, Shuwei2,3, shuweiqu1222@nuc.edu.cn, Wang, Hongfu2,3, Li, Ruiqin2, Yao, Wei2,3
Source: Journal of Wuhan University of Technology; Apr2026, Vol. 41 Issue 2, p512-522, 11p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192924046
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition.
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  Data: <searchLink fieldCode="AU" term="%22Han%2C+Yafeng%22">Han, Yafeng</searchLink><relatesTo>1</relatesTo>, <i>546032664@qq.com</i><br /><searchLink fieldCode="AU" term="%22Hao%2C+Bohao%22">Hao, Bohao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Qu%2C+Shuwei%22">Qu, Shuwei</searchLink><relatesTo>2,3</relatesTo>, <i>shuweiqu1222@nuc.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Wang%2C+Hongfu%22">Wang, Hongfu</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Ruiqin%22">Li, Ruiqin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yao%2C+Wei%22">Yao, Wei</searchLink><relatesTo>2,3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Wuhan+University+of+Technology%22">Journal of Wuhan University of Technology</searchLink>; Apr2026, Vol. 41 Issue 2, p512-522, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192924046
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11595-026-3270-5
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 512
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      – TitleFull: Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition.
        Type: main
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            NameFull: Han, Yafeng
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            NameFull: Hao, Bohao
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            NameFull: Qu, Shuwei
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            NameFull: Wang, Hongfu
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            NameFull: Li, Ruiqin
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            – D: 01
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
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              Value: 41
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