Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.
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| Title: | Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation. |
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| Authors: | Ma, Shuai1, Sun, Yi1, sunyi@hit.edu.cn, Nan, Yifei1, Liu, Yizhi1, Yang, Zhiqiang1 |
| Source: | Journal of Materials Science: Materials in Electronics; May2026, Vol. 37 Issue 13, p1-28, 28p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-026-17409-3 |
