View in EDS

Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.

Saved in:
Bibliographic Details
Title: Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.
Authors: Ma, Shuai1, Sun, Yi1, sunyi@hit.edu.cn, Nan, Yifei1, Liu, Yizhi1, Yang, Zhiqiang1
Source: Journal of Materials Science: Materials in Electronics; May2026, Vol. 37 Issue 13, p1-28, 28p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193394564
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Ma%2C+Shuai%22">Ma, Shuai</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Yi%22">Sun, Yi</searchLink><relatesTo>1</relatesTo>, <i>sunyi@hit.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Nan%2C+Yifei%22">Nan, Yifei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Yizhi%22">Liu, Yizhi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Zhiqiang%22">Yang, Zhiqiang</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2026, Vol. 37 Issue 13, p1-28, 28p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193394564
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-026-17409-3
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 28
        StartPage: 1
    Titles:
      – TitleFull: Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Ma, Shuai
      – PersonEntity:
          Name:
            NameFull: Sun, Yi
      – PersonEntity:
          Name:
            NameFull: Nan, Yifei
      – PersonEntity:
          Name:
            NameFull: Liu, Yizhi
      – PersonEntity:
          Name:
            NameFull: Yang, Zhiqiang
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 05
              Text: May2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 37
            – Type: issue
              Value: 13
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1