Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
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| Title: | Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. |
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| Authors: | Hsieh, C. L.1, chen-lin.hsieh19@imperial.ac.uk, Coyle, R. J.2, Xian, J. W.1,3, Gourlay, C. M.1, c.gourlay@imperial.ac.uk |
| Source: | Journal of Materials Science; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00222461 |
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| DOI: | 10.1007/s10853-026-12718-8 |
