Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.

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Title: Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
Authors: Hsieh, C. L.1, chen-lin.hsieh19@imperial.ac.uk, Coyle, R. J.2, Xian, J. W.1,3, Gourlay, C. M.1, c.gourlay@imperial.ac.uk
Source: Journal of Materials Science; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193564429
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Hsieh%2C+C%2E+L%2E%22">Hsieh, C. L.</searchLink><relatesTo>1</relatesTo>, <i>chen-lin.hsieh19@imperial.ac.uk</i><br /><searchLink fieldCode="AU" term="%22Coyle%2C+R%2E+J%2E%22">Coyle, R. J.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Xian%2C+J%2E+W%2E%22">Xian, J. W.</searchLink><relatesTo>1,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Gourlay%2C+C%2E+M%2E%22">Gourlay, C. M.</searchLink><relatesTo>1</relatesTo>, <i>c.gourlay@imperial.ac.uk</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193564429
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10853-026-12718-8
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      – Code: eng
        Text: English
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        PageCount: 31
        StartPage: 16674
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      – TitleFull: Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
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            NameFull: Hsieh, C. L.
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            NameFull: Coyle, R. J.
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            NameFull: Xian, J. W.
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              Text: Jun2026
              Type: published
              Y: 2026
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