Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
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| Title: | Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. |
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| Authors: | Hsieh, C. L.1, chen-lin.hsieh19@imperial.ac.uk, Coyle, R. J.2, Xian, J. W.1,3, Gourlay, C. M.1, c.gourlay@imperial.ac.uk |
| Source: | Journal of Materials Science; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 193564429 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Hsieh%2C+C%2E+L%2E%22">Hsieh, C. L.</searchLink><relatesTo>1</relatesTo>, <i>chen-lin.hsieh19@imperial.ac.uk</i><br /><searchLink fieldCode="AU" term="%22Coyle%2C+R%2E+J%2E%22">Coyle, R. J.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Xian%2C+J%2E+W%2E%22">Xian, J. W.</searchLink><relatesTo>1,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Gourlay%2C+C%2E+M%2E%22">Gourlay, C. M.</searchLink><relatesTo>1</relatesTo>, <i>c.gourlay@imperial.ac.uk</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193564429 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10853-026-12718-8 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 31 StartPage: 16674 Titles: – TitleFull: Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hsieh, C. L. – PersonEntity: Name: NameFull: Coyle, R. J. – PersonEntity: Name: NameFull: Xian, J. W. – PersonEntity: Name: NameFull: Gourlay, C. M. IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 06 Text: Jun2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 00222461 Numbering: – Type: volume Value: 61 – Type: issue Value: 23 Titles: – TitleFull: Journal of Materials Science Type: main |
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