Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.
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| Title: | Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys. |
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| Authors: | Lin, Wei-Ting1, Hsu, Chia-Jung1, Chang, Po-Kai1, Li, Kelvin2, Lin, Kuo-Shu2, Wang, Chang-Meng2, Wu, Albert T.1, atwu@ncu.edu.tw |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5207-5218, 12p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10474838 |
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| DOI: | 10.1007/s11837-026-08175-y |
