APA (7th ed.) Citation

Lin, W., Hsu, C., Chang, P., Li, K., Lin, K., Wang, C., & Wu, A. T. (2026). Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 78(6), 5207. https://doi.org/10.1007/s11837-026-08175-y

Chicago Style (17th ed.) Citation

Lin, Wei-Ting, Chia-Jung Hsu, Po-Kai Chang, Kelvin Li, Kuo-Shu Lin, Chang-Meng Wang, and Albert T. Wu. "Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 78, no. 6 (2026): 5207. https://doi.org/10.1007/s11837-026-08175-y.

MLA (9th ed.) Citation

Lin, Wei-Ting, et al. "Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 78, no. 6, 2026, p. 5207, https://doi.org/10.1007/s11837-026-08175-y.