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Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.

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Title: Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.
Authors: Lin, Wei-Ting1, Hsu, Chia-Jung1, Chang, Po-Kai1, Li, Kelvin2, Lin, Kuo-Shu2, Wang, Chang-Meng2, Wu, Albert T.1, atwu@ncu.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5207-5218, 12p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193654179
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11837-026-08175-y
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 12
        StartPage: 5207
    Titles:
      – TitleFull: Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Lin, Wei-Ting
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            NameFull: Hsu, Chia-Jung
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            NameFull: Chang, Po-Kai
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            NameFull: Li, Kelvin
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            NameFull: Lin, Kuo-Shu
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            NameFull: Wang, Chang-Meng
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            NameFull: Wu, Albert T.
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          Dates:
            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 78
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              Value: 6
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            – TitleFull: JOM: The Journal of The Minerals, Metals & Materials Society (TMS)
              Type: main
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