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Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.

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Bibliographic Details
Title: Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys.
Authors: Lin, Wei-Ting1, Hsu, Chia-Jung1, Chang, Po-Kai1, Li, Kelvin2, Lin, Kuo-Shu2, Wang, Chang-Meng2, Wu, Albert T.1, atwu@ncu.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5207-5218, 12p
Database: Applied Science & Technology Source
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