Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder.
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| Title: | Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder. |
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| Authors: | Chou, Jing-Ting1, Lee, Hao-Wei1, Lin, Yi-Pin1, Cheng, Yu-Jhen1, Yen, Yee-Wen1,2, ywyen@mail.ntust.edu.tw |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5253-5263, 11p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10474838 |
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| DOI: | 10.1007/s11837-026-08232-6 |
