APA (7th ed.) Citation

Chou, J., Lee, H., Lin, Y., Cheng, Y., & Yen, Y. (2026). Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 78(6), 5253. https://doi.org/10.1007/s11837-026-08232-6

Chicago Style (17th ed.) Citation

Chou, Jing-Ting, Hao-Wei Lee, Yi-Pin Lin, Yu-Jhen Cheng, and Yee-Wen Yen. "Interfacial Reactions Between Ni-Electroplated Cu- 2.35 Wt%Fe Alloy (C194) and Molten Sn Solder." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 78, no. 6 (2026): 5253. https://doi.org/10.1007/s11837-026-08232-6.

MLA (9th ed.) Citation

Chou, Jing-Ting, et al. "Interfacial Reactions Between Ni-Electroplated Cu- 2.35 Wt%Fe Alloy (C194) and Molten Sn Solder." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 78, no. 6, 2026, p. 5253, https://doi.org/10.1007/s11837-026-08232-6.