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Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder.

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Title: Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder.
Authors: Chou, Jing-Ting1, Lee, Hao-Wei1, Lin, Yi-Pin1, Cheng, Yu-Jhen1, Yen, Yee-Wen1,2, ywyen@mail.ntust.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5253-5263, 11p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193654184
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder.
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      – Type: doi
        Value: 10.1007/s11837-026-08232-6
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 5253
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      – TitleFull: Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder.
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            NameFull: Chou, Jing-Ting
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            NameFull: Lee, Hao-Wei
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            NameFull: Lin, Yi-Pin
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            NameFull: Cheng, Yu-Jhen
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            NameFull: Yen, Yee-Wen
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            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 78
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