Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.
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| Title: | Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network. |
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| Authors: | Zhang, Zhenxuan1, zzhang98@binghamton.edu, Li, Yuanyuan1, yli352@binghamton.edu, Yoon, Sang Won1, yoons@binghamton.edu, Park, Seungbae1, sbpark@binghamton.edu, Won, Daehan1, dwon@binghamton.edu |
| Source: | Microelectronics Reliability; Jun2026, Vol. 181, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2026.116125 |
