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Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.

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Title: Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.
Authors: Zhang, Zhenxuan1, zzhang98@binghamton.edu, Li, Yuanyuan1, yli352@binghamton.edu, Yoon, Sang Won1, yoons@binghamton.edu, Park, Seungbae1, sbpark@binghamton.edu, Won, Daehan1, dwon@binghamton.edu
Source: Microelectronics Reliability; Jun2026, Vol. 181, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193660255
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.
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  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Zhenxuan%22">Zhang, Zhenxuan</searchLink><relatesTo>1</relatesTo>, <i>zzhang98@binghamton.edu</i><br /><searchLink fieldCode="AU" term="%22Li%2C+Yuanyuan%22">Li, Yuanyuan</searchLink><relatesTo>1</relatesTo>, <i>yli352@binghamton.edu</i><br /><searchLink fieldCode="AU" term="%22Yoon%2C+Sang+Won%22">Yoon, Sang Won</searchLink><relatesTo>1</relatesTo>, <i>yoons@binghamton.edu</i><br /><searchLink fieldCode="AU" term="%22Park%2C+Seungbae%22">Park, Seungbae</searchLink><relatesTo>1</relatesTo>, <i>sbpark@binghamton.edu</i><br /><searchLink fieldCode="AU" term="%22Won%2C+Daehan%22">Won, Daehan</searchLink><relatesTo>1</relatesTo>, <i>dwon@binghamton.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>; Jun2026, Vol. 181, pN.PAG-N.PAG, 1p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193660255
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2026.116125
    Languages:
      – Code: eng
        Text: English
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        PageCount: 1
        StartPage: N.PAG
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      – TitleFull: Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.
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      – PersonEntity:
          Name:
            NameFull: Zhang, Zhenxuan
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            NameFull: Li, Yuanyuan
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            NameFull: Yoon, Sang Won
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            NameFull: Park, Seungbae
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            NameFull: Won, Daehan
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            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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            – Type: issn-print
              Value: 00262714
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              Value: 181
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            – TitleFull: Microelectronics Reliability
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