Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs.
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| Title: | Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs. |
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| Authors: | Wang, Zhihua1, Zhang, Kaixin2, 000q825121@fafu.edu.cn, Yan, Qun1, qunfyan@fzu.edu.cn, Lin, Chang3, Zhou, Xiongtu3, Sun, Jie1, jie.sun@fzu.edu.cn |
| Source: | IEEE Transactions on Semiconductor Manufacturing; May2026, Vol. 39 Issue 2, p184-189, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 08946507 |
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| DOI: | 10.1109/TSM.2026.3661882 |
