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Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs.

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Title: Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs.
Authors: Wang, Zhihua1, Zhang, Kaixin2, 000q825121@fafu.edu.cn, Yan, Qun1, qunfyan@fzu.edu.cn, Lin, Chang3, Zhou, Xiongtu3, Sun, Jie1, jie.sun@fzu.edu.cn
Source: IEEE Transactions on Semiconductor Manufacturing; May2026, Vol. 39 Issue 2, p184-189, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193839470
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Zhihua%22">Wang, Zhihua</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Kaixin%22">Zhang, Kaixin</searchLink><relatesTo>2</relatesTo>, <i>000q825121@fafu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Yan%2C+Qun%22">Yan, Qun</searchLink><relatesTo>1</relatesTo>, <i>qunfyan@fzu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Lin%2C+Chang%22">Lin, Chang</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Xiongtu%22">Zhou, Xiongtu</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Jie%22">Sun, Jie</searchLink><relatesTo>1</relatesTo>, <i>jie.sun@fzu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Semiconductor+Manufacturing%22">IEEE Transactions on Semiconductor Manufacturing</searchLink>; May2026, Vol. 39 Issue 2, p184-189, 6p
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/TSM.2026.3661882
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 184
    Titles:
      – TitleFull: Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs.
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      – PersonEntity:
          Name:
            NameFull: Wang, Zhihua
      – PersonEntity:
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            NameFull: Zhang, Kaixin
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            NameFull: Yan, Qun
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            NameFull: Lin, Chang
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            NameFull: Zhou, Xiongtu
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            NameFull: Sun, Jie
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            – D: 01
              M: 05
              Text: May2026
              Type: published
              Y: 2026
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            – TitleFull: IEEE Transactions on Semiconductor Manufacturing
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