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Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.

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Bibliographic Details
Title: Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.
Authors: Qin, Xingwen1, Yin, Dongxian1,2, Yu, Zibo1,3, Qin, Hongbo1,4, Yan, Haidong1,2, Wu, Junke1,2, Li, Jian3, He, Siliang1,4, siliang_he@guet.edu.cn
Source: Crystals (2073-4352); May2026, Vol. 16 Issue 5, p353, 12p
Database: Applied Science & Technology Source
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ISSN:20734352
DOI:10.3390/cryst16050353