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Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.

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Title: Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.
Authors: Qin, Xingwen1, Yin, Dongxian1,2, Yu, Zibo1,3, Qin, Hongbo1,4, Yan, Haidong1,2, Wu, Junke1,2, Li, Jian3, He, Siliang1,4, siliang_he@guet.edu.cn
Source: Crystals (2073-4352); May2026, Vol. 16 Issue 5, p353, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 194118406
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.
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      – Type: doi
        Value: 10.3390/cryst16050353
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 353
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      – TitleFull: Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase Bonding.
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            NameFull: Qin, Xingwen
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            NameFull: Yin, Dongxian
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            NameFull: Yan, Haidong
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            NameFull: Wu, Junke
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            NameFull: Li, Jian
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            – D: 01
              M: 05
              Text: May2026
              Type: published
              Y: 2026
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            – TitleFull: Crystals (2073-4352)
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