Mechanical response and ductile-to-brittle fracture transition of Sn-0.3Ag-0.7Cu/Cu solder joints at cryogenic temperatures.
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| Title: | Mechanical response and ductile-to-brittle fracture transition of Sn-0.3Ag-0.7Cu/Cu solder joints at cryogenic temperatures. |
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| Authors: | Jiang, Wen1, Wu, Wenwang2, Zhu, Yaxin1,3, yxzhu2006@hust.edu.cn, Wang, Changwei1,3 |
| Source: | Journal of Materials Science; Jul2026, Vol. 61 Issue 27, p19834-19852, 19p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00222461 |
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| DOI: | 10.1007/s10853-026-13001-6 |
