Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.
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| Title: | Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper. |
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| Authors: | Satish, A. M.1, Vatnalmath, M.2, Bharath, V.2, Auradi, V.1, vsauradi@gmail.com, VijayKashimatt, M. G.3, Veeresh, V.2, Srinivas, S. N.2, Nagaral, M.4 |
| Source: | Canadian Metallurgical Quarterly; Jul2026, Vol. 65 Issue 3, p2866-2879, 14p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00084433 |
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| DOI: | 10.1080/00084433.2025.2578557 |
