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Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.

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Bibliographic Details
Title: Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.
Authors: Satish, A. M.1, Vatnalmath, M.2, Bharath, V.2, Auradi, V.1, vsauradi@gmail.com, VijayKashimatt, M. G.3, Veeresh, V.2, Srinivas, S. N.2, Nagaral, M.4
Source: Canadian Metallurgical Quarterly; Jul2026, Vol. 65 Issue 3, p2866-2879, 14p
Database: Applied Science & Technology Source
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