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Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.

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Bibliographic Details
Title: Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.
Authors: Soares, Matheus De Araujo1, Campion, Donatien1, Leclercq, Aurore1, Kreitcberg, Alena1, Brailovski, Vladimir1, vladimir.brailovski@etsmtl.ca
Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 12, p5850, 27p
Database: Applied Science & Technology Source
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ISSN:20763417
DOI:10.3390/app16125850