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Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.

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Title: Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.
Authors: Soares, Matheus De Araujo1, Campion, Donatien1, Leclercq, Aurore1, Kreitcberg, Alena1, Brailovski, Vladimir1, vladimir.brailovski@etsmtl.ca
Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 12, p5850, 27p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 194910058
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PubType: Academic Journal
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  Data: Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=194910058
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        Value: 10.3390/app16125850
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        Text: English
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      – TitleFull: Reliability of Thermal Conduction-Based Melt Pool Simulations Using In-Process Thermal Camera and Post-Process Single-Track Measurements.
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              Text: Jun2026
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              Y: 2026
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