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CFET channel stack fabrication by wafer-to-wafer bonding and BESOI donor dismounting.

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Bibliographic Details
Title: CFET channel stack fabrication by wafer-to-wafer bonding and BESOI donor dismounting.
Authors: Tchoulfian, P.1, pauline.tchoulfian@cea.fr, Barge, D.1, Hartmann, J.M.1, Kerdilès, S.1, Larrey, V.1, Fournel, F.1, Loup, V.1, Hauchecorne, P.1, Papon, A.M.1, Thouvard, A.1, Richy, J.1, Mazel, Y.1, Gauthier, N.1, Fraczkiewicz, A.1, Pares, G.1, Schippers, D.2, Jain, U.2, Brems, S.2, Loo, R.2,3, Chan, B.T.2
Source: Materials Science in Semiconductor Processing; Nov2026, Vol. 214, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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