Wang, R., Lin, Y., Lin, Z., Lin, D., Yang, Z., & Yu, X. (2026). Enhancement of shallow trench isolation top corner rounding for high-volume manufacturing. Journal of Materials Science: Materials in Electronics, 37(19), 1. https://doi.org/10.1007/s10854-026-17801-z
Chicago Style (17th ed.) CitationWang, Ran, You-Cheng Lin, Zi-Ren Lin, Dong-Yi Lin, Zhi-Qiang Yang, and Xin-Yao Yu. "Enhancement of Shallow Trench Isolation Top Corner Rounding for High-volume Manufacturing." Journal of Materials Science: Materials in Electronics 37, no. 19 (2026): 1. https://doi.org/10.1007/s10854-026-17801-z.
MLA (9th ed.) CitationWang, Ran, et al. "Enhancement of Shallow Trench Isolation Top Corner Rounding for High-volume Manufacturing." Journal of Materials Science: Materials in Electronics, vol. 37, no. 19, 2026, p. 1, https://doi.org/10.1007/s10854-026-17801-z.