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Enhancement of shallow trench isolation top corner rounding for high-volume manufacturing.

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Title: Enhancement of shallow trench isolation top corner rounding for high-volume manufacturing.
Authors: Wang, Ran1,2, Lin, You-Cheng2, Lin, Zi-Ren2, Lin, Dong-Yi2, Yang, Zhi-Qiang2, nexchip_etching@163.com, Yu, Xin-Yao1, yuxinyao@ahu.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Jul2026, Vol. 37 Issue 19, p1-15, 15p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 195673890
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Enhancement of shallow trench isolation top corner rounding for high-volume manufacturing.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Ran%22">Wang, Ran</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+You-Cheng%22">Lin, You-Cheng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Zi-Ren%22">Lin, Zi-Ren</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Dong-Yi%22">Lin, Dong-Yi</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Zhi-Qiang%22">Yang, Zhi-Qiang</searchLink><relatesTo>2</relatesTo>, <i>nexchip_etching@163.com</i><br /><searchLink fieldCode="AU" term="%22Yu%2C+Xin-Yao%22">Yu, Xin-Yao</searchLink><relatesTo>1</relatesTo>, <i>yuxinyao@ahu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jul2026, Vol. 37 Issue 19, p1-15, 15p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=195673890
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-026-17801-z
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 15
        StartPage: 1
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      – TitleFull: Enhancement of shallow trench isolation top corner rounding for high-volume manufacturing.
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            NameFull: Wang, Ran
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            NameFull: Lin, You-Cheng
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            NameFull: Lin, Zi-Ren
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            NameFull: Lin, Dong-Yi
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            NameFull: Yang, Zhi-Qiang
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            NameFull: Yu, Xin-Yao
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          Dates:
            – D: 01
              M: 07
              Text: Jul2026
              Type: published
              Y: 2026
          Identifiers:
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              Value: 37
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              Value: 19
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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