Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas.

Saved in:
Bibliographic Details
Title: Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas.
Authors: Lee, C. H.1,2, nelee@skku.edu, Kim, D. H.3, Lee, N.-E.1,2, Kwon, G. C.3
Source: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; Jul2006, Vol. 24 Issue 4, p1386-1394, 9p, 3 Black and White Photographs, 6 Graphs
Database: Applied Science & Technology Source
Description
ISSN:07342101
DOI:10.1116/1.2201059