Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas.
Saved in:
| Title: | Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas. |
|---|---|
| Authors: | Lee, C. H.1,2, nelee@skku.edu, Kim, D. H.3, Lee, N.-E.1,2, Kwon, G. C.3 |
| Source: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; Jul2006, Vol. 24 Issue 4, p1386-1394, 9p, 3 Black and White Photographs, 6 Graphs |
| Database: | Applied Science & Technology Source |
| ISSN: | 07342101 |
|---|---|
| DOI: | 10.1116/1.2201059 |