1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations.
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| Title: | 1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations. |
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| Authors: | Çelik-Butler, Z. |
| Source: | Solid-State Electronics; July 1996, Vol. 39, p999-1003, 5p |
| Database: | Applied Science & Technology Source |
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